PLUG-IN-SIDEWALL METAL PACKAGE FOR HYBRID INTEGRATED CIUCUIT
Application areas:All kinds of hybrid thick film and thin-film integrated circuits package,Suitable for plug-in assembly. Material:4J29(Fe/Ni/Co alloy). Surface finish:Ni/Au plating,selective Au plating. Technical requirement:All of the property index should conform to the requirements of GJB 2440《General Standard of Hybrid Integrated Circuit Package》
