Application areas:All kinds of photolauncher、photodetecter、and photoamplifier. Products type:Mainly divided into butterfly-type and cavity plug-in package with photoconductive. Material:4J29alloy or Tungsten-copper alloy. Surface finish:Ni/Au plating, Technical requirement:All of the property index should conform to the requirements of GJB 2440《General Standard of Hybrid Integrated Circuit Package》
